Semiconductor device
US11462257B2 · kind B2 · utility
0Cited by
16References
19Claims
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Assignee
Inventor
Key dates
| Filing date | Jul 30, 2021 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Jul 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06589
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided, including a plurality of memory chips and a temperature detection module. The temperature detection module includes: a plurality of temperature detection units, in which the plurality of temperature detection units are disposed on at least part of the memory chips to detect the temperatures of at least part of the memory chips; and a processing unit, in which the plurality of temperature detection units share the processing unit with each other, and the processing unit is configured to process a signal of at least one of the temperature detection units.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.