Ceramic-circuit composite structure and method for making the same
US11462430B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2019 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Sep 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/12
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a ceramic-circuit composite structure, comprising: a ceramic plate with a supporting surface that has a recessed supporting portion; a curved-surface circuit buried in the ceramic plate; and a power supply module electrically connected to the curved-surface circuit. Moreover, the present invention provides a method for making the ceramic-circuit composite structure. The ceramic-circuit composite structure of the present invention makes use of the curved-surface circuit to improve the prior art problem that a planar circuit has less static electricity or lower temperature at the center than in the peripheral region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.