Display module having LED packages including connection substrate
US11462523B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2020 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | May 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/852
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A display module and a manufacturing method thereof is provided. The display module may include a substrate; a thin film transistor (TFT) layer disposed on a surface of the substrate; a plurality of LED packages including a connection substrate and a plurality of LEDs disposed on a first surface of the connection substrate; and a wiring configured to electrically connect the TFT layer and the plurality of LEDs. The wiring includes a first wiring for electrically coupling with the plurality of LEDs on the first surface, and a second wiring for electrically coupling with the TFT layer on a second surface of the connection substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.