Thermoelectric device structures
US11462669B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 19, 2018 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Mar 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N19/101
Abstract
The present disclosure is related to structures for and methods for producing thermoelectric devices. The thermoelectric devices include multiple stages of thermoelements. Each stage includes alternating n-type and p-type thermoelements. The stages are sandwiched between upper and lower sets of metal links fabricated on a pair of substrate layers. The metal links electrically connect pairs of n-type and p-type thermoelements from each stage. There may be additional sets of metal links between the multiple stages. The individual thermoelements may be sized to handle differing amounts of electric current to optimize performance based on their location within the multistage device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.