Electronic device including conductive structure connecting electrically ground layer of flexible printed circuit board and ground layer of printed circuit board
US11462846B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2019 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Oct 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10371
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
According to various embodiments, an electronic device may include a housing including a first plate, a second plate facing away from the first plate, and a side housing surrounding a space between the first plate and the second plate and joined to the second plate or provided integrally with the second plate, a display viewable through at least part of the first plate, a first Printed Circuit Board (PCB) disposed between the first plate and the second plate and including at least one first ground layer, a Flexible Printed Circuit Board (FPCB) at least partially overlapping the first PCB when viewed from above the first plate and including a first end electrically coupled to the first PCB, a second end, and at least one second ground layer, and a conductive structure comprising a conductive material disposed between the first PCB and the FPCB and electrically coupling the first ground layer and the second ground layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.