Printed circuit board assembly
US11464113B2 · kind B2 · utility
0Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2020 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | May 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10545
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A printed circuit board assembly is disclosed. The printed circuit board assembly includes a printed circuit board, a sensor mounted on one side of the printed circuit board to detect a magnetic field, and a bus bar disposed in contact with another side of the printed circuit board, wherein a thickness between a region of the another side of the printed circuit board, with which the bus bar is in contact, and the one side of the printed circuit board is smaller than a thickness between a remaining region of the another side of the printed circuit board and the one side of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.