Method for depositing functional traces
US11464115B2 · kind B2 · utility
0Cited by
10References
20Claims
0Family size
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Key dates
| Filing date | Mar 8, 2018 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Nov 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a printing method comprising a step of printing a pattern on a substrate, preferably by ink jet printing, followed by a gold plating step by means of contact between the pre-printed pattern to be gold plated and a gold plating deposition device, such as a preferably conductive metal sheet, e.g. a multilayer film comprising a preferably conductive metal sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.