Liquid cooling enclosure for circuit components
US11464135B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 4, 2020 |
| Grant date | Oct 4, 2022 |
| Priority date | — |
| Expiry date | Dec 4, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20254
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A liquid cooling enclosure configured to house and cool at least one circuit component, the liquid cooling enclosure including an inner wall, an outer wall, the outer wall being spaced from the inner wall to form an internal channel, an inlet in fluid communication with the internal channel, the inlet being configured to receive cooling liquid, and an outlet in fluid communication with the internal channel, the outlet being configured to return cooling liquid, wherein the at least one circuit component is positioned within the liquid cooling enclosure and the cooling liquid is circulated around the at least one circuit component via the internal channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.