Polyimide precursor composition and polyimide film using same
US11466124B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2018 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Feb 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/423
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyimide precursor composition according to the present invention enables alleviation of thermal expansion-contraction properties of a polyimide film resultingly prepared, by means of using siloxane-based diamine having a particular structure and a solvent having a positive partition coefficient. And the present invention enables excellent transparency, heat resistance, mechanical strength and flexibility and effective reduction of residual stress, and thus can be used in various fields such as a substrate for a device, a cover substrate for a display, an optical film, an integrated circuit (IC) package, an adhesive film, a multi-layer flexible printed circuit (FPC), tape, a touch panel and a protective film for an optical disk.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.