Fiber-reinforced polymer composition for use in an electronic module
US11466130B2 · kind B2 · utility
3Cited by
27References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 14, 2018 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Mar 1, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01S17/931
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A fiber-reinforced polymer composition that comprises a polymer matrix; a thermally conductive filler distributed within the polymer matrix; and a plurality of long fibers distributed within the polymer matrix is provided. The long fibers comprise an electrically conductive material and have a length of about 7 millimeters or more. Further, the composition exhibits an in-plane thermal conductivity of about 1 W/m-K or more as determined in accordance with ASTM E 1461-13 and an electromagnetic shielding effectiveness of about 20 dB or more as determined at a frequency of 1 GHz in accordance with EM 2107A.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.