Submerged underwater electroless, electrochemical deposition of metal on conductive and nonconductive surfaces
US11466355B1 · kind B1 · utility
0Cited by
8References
19Claims
0Family size
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Key dates
| Filing date | Jul 20, 2017 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Jul 20, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB63G8/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Electroless underwater metal plating of a surface of fixed or floating structure is accomplished by transferring to the surface metal ions from a metal precursor in a solid or semisolid electrolyte that is pressed against and moved over a submerged surface. Metal ions from a metal salt blended in the solid or semisolid material plate the underwater substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.