Inversion-based array processing for cement-bond evaluation with an LWD tool
US11466558B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jun 18, 2020 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Apr 2, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01V2210/614
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Logging of data by a downhole tool disposed in a borehole may be affected by tool wave effects. The tool waves appear in the first echo of casing wave arrivals and the amplitudes may be much larger than casing wave arrivals. The estimates of casing wave amplitude are biased due to these tool wave arrivals when using conventional cement-bond logging (CBL) processing. An automated adaptive inversion-based array processing for CBL evaluation using a downhole tool provides an improvement in the calculation of a bonding index.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.