Modular computer cooling system
US11467637B2 · kind B2 · utility
2Cited by
20References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2019 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Jul 25, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular cooling system can include thermal bridges for separate modules of a computer system that passively transfer heat away from heat sources of the modules. The thermal bridges can be thermally connected to a cold plate having a fluid path for liquid coolant. The cold plate can be positioned in, or linked to, a cooling dock having a pump and at least one cooling element such as a radiator or fan system. Heat from separate modules can be passively transferred via thermal bridges to cold plates, where liquid pumped through the cold plates can transfer the heat to the cooling elements of the cooling dock to be dissipated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.