Electronic device including display module including sensor and method for manufacturing the display module
US11468700B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2020 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Sep 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M2250/12
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Disclosed is an electronic device that includes a housing, a display module that includes a first panel including a first surface, a second surface opposite to the first surface, and a plurality of pixels disposed between the first surface and the second surface, a cover layer that is disposed on the first surface of the first panel and that forms one surface of the housing, and a second panel disposed on the second surface of the first panel, and a sensor that is coupled to the display module and that forms a sensing area on the one surface of the housing. The display module includes an opening that is formed through the second panel and in which the sensor is disposed, and the sensor includes an active area and an inactive area formed around the active area. A first adhesive material is formed between the active area and the first panel. The first adhesive material includes a mechanical or thermal characteristic that a glass transition temperature Tg ranges from 0° C. to 25° C. in a frequency condition of 0.01 Hz to 0.1 Hz, a modulus of elasticity at 35° C. or more is 0.2 GPa or less, and a modulus of elasticity at −10° C. or less is 1 GPa or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.