Heat dissipation structure for magnetic component and magnetic component having the same
US11469035B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2019 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Aug 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2027/297
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a heat dissipation structure for a magnetic component and a magnetic component having the same. The magnetic component includes a plurality of heat dissipation pins, which are disposed on the winding of the magnetic component, wherein the magnetic component has one or more windings. The heat dissipation structure includes a circuit board on which a plurality of heat dissipation channels are disposed, and the heat dissipation pins of the windings are in contact with the heat dissipation channels; a plurality of heat conduction portions are disposed correspondingly under the heat dissipation channels of the circuit board; a heat conduction layer is arranged under the heat conduction portions and contacts with the heat conduction portions; and a heat dissipation layer is arranged under the heat conduction layer and contacts with the heat conduction layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.