Multilayer capacitor and board having the same mounted thereon
US11469051B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2021 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Apr 16, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 μm or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.