Interconnect using nanoporous metal locking structures
US11469199B2 · kind B2 · utility
1Cited by
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20Claims
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Key dates
| Filing date | Nov 20, 2020 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Nov 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments relate to the design of a device capable of maintaining the alignment an interconnect by resisting lateral forces acting on surfaces of the interconnect. The device comprises a first body comprising a first surface with a nanoporous metal structure protruding from the first surface. The device further comprises a second body comprising a second surface with a locking structure to resist a lateral force between the first body and the second body during or after assembly of the first body and the second body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.