Method for forming package structure with a barrier layer
US11469203B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2020 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Dec 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3841
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a package structure includes forming an under bump metallization (UBM) layer over a metal pad and forming a photoresist layer over the UBM layer. The method further includes patterning the photoresist layer to form an opening in the photoresist layer. The method also includes forming a first bump structure over the first portion of the UBM layer. The first bump structure includes a first barrier layer over a first pillar layer. The method includes placing a second bump structure over the first bump structure. The second bump structure includes a second barrier layer over a second pillar layer. The method further includes reflowing the first bump structure and the second bump structure to form a solder joint between a first inter intermetallic compound (IMC) and a second IMC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.