Chip-on-film structure, displaying base plate and displaying device
US11469211B2 · kind B2 · utility
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1References
16Claims
0Family size
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Key dates
| Filing date | Apr 6, 2021 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Apr 8, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A Chip-On-Film structure, a displaying base plate and a displaying device, wherein the Chip-On-Film structure includes a first substrate; a plurality of driving chips provided on one side of the first substrate, and a plurality of first leads that are connected to the plurality of driving chips; and the plurality of first leads are for binding a displaying base plate, and a quantity of the first leads is greater than or equal to a sum of quantities of channels of the plurality of driving chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.