Backplane and glass-based circuit board
US11469359B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 30, 2019 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Feb 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2054
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units (110) includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line (200) and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The light-emitting diode chips (300) in the at least one light-emitting sub-unit are connected in series.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.