Encapsulation system for electronic components and batteries
US11469464B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 28, 2018 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Jun 13, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Systems, methods, and apparatus for encapsulating objects like that of microelectronic components and batteries. The system includes three successive layers that include a first covering layer composed of an electrically insulating material deposited by atomic layer deposition, which at least partly covers the object, a second covering layer that includes parylene and/or polyimide, and which is disposed on the first covering layer, and a third covering layer deposited on the second covering layer in such a way as to protect the second encapsulation layer, namely, with respect to oxygen, and thereby increase the service life of the object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.