Apparatus and method relating to electrochemical migration
US11470727B2 · kind B2 · utility
0Cited by
19References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 23, 2017 |
| Grant date | Oct 11, 2022 |
| Priority date | — |
| Expiry date | Jun 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention provide a method (1000) of assembling an electrical circuit comprising one or more copper electrical conductors, the method comprising plating (1010) a surface of the one or more conductors with a layer comprising tin; annealing the plating; applying (1020) solder to at least a portion of the one or more electrical conductors, wherein said solder comprises tin and copper; and annealing the electrical circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.