Phased array ultrasonic transducer and method of manufacture
US11471911B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2017 |
| Grant date | Oct 18, 2022 |
| Priority date | — |
| Expiry date | Dec 4, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/106
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A phased array ultrasonic transducer includes a bonding wire structure, a damping material, a plurality of ultrasonic transducers, and a printed circuit board. The bonding wire structure includes a plurality of bonding wire elements. The damping material surrounds the bonding wire structure and is interposed with the plurality of bonding wire elements. The plurality of ultrasonic transducers is arranged in a matrix beneath a membrane, each of the plurality of ultrasonic transducers being coupled to a corresponding bonding wire element of the plurality of bonding wire elements. The printed circuit board includes a plurality of circuits. Each of the plurality of circuits is coupled to a corresponding bonding wire element of the plurality of bonding wire elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.