Lamination molding apparatus
US11471945B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2020 |
| Grant date | Oct 18, 2022 |
| Priority date | — |
| Expiry date | Dec 18, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A lamination molding apparatus includes: a material layer forming device that forms a material layer in a molding region; an irradiator that sinters or melts the material layer to form a solidified layer; and a cooling device that cools, to a cooling temperature, at least a part including an upper surface of a solidified body. The material layer forming device includes: a base having the molding region, a recoater head disposed on the base, a recoater head driving device that reciprocates the recoater head in a horizontal direction, and a blade that is arranged on the recoater head and that levels material powder to form the material layer. The cooling device includes: a cooling body that is controlled to the cooling temperature and comes into contact with the upper surface of the solidified body, and a mounting member that mounts the cooling body to the recoater head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.