Wire fixation apparatus and soldering method
US11471967B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 13, 2019 |
| Grant date | Oct 18, 2022 |
| Priority date | — |
| Expiry date | Apr 12, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0195
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A fixation apparatus includes a base, a wire fixing device mounted on the base, and a pressing device mounted on the base. The wire fixing device positions and fixes a wire on a circuit board and includes a fixing frame mounted on the base and a moving unit received in a receiving chamber of the fixing frame. The fixing frame has a first positioning groove. The moving unit is movable between a clamping position and a release position and has a second positioning groove coupled with the first positioning groove. The wire is inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the mobile unit is moved to the release position. The wire is clamped and fixed between the first positioning groove and the second positioning groove when the moving unit is moved to the clamping position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.