Patent · US Active

Monitoring a thermal cutting process

US11471977B2 · kind B2 · utility

1Cited by

3References

21Claims

0Family size

Assignee

TRUMPF Werkzeugmaschinen GmbH + Co. KG · DE

Inventors

Winfried Magg · Ditzingen, DE
David Schindhelm · Stuttgart, DE
Boris Regaard · Gerlingen, DE
Oliver Bocksrocker · Sachsenheim, DE
Volker Rominger · Steinheim an der Murr, DE

Key dates

Filing date	Apr 12, 2019
Grant date	Oct 18, 2022
Priority date	—
Expiry date	Jun 28, 2040

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K31/125
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A device for monitoring, in particular for closed-loop control, of a thermal cutting process carried out on a workpiece. The device includes a focusing unit for focusing a machining beam, in particular a laser beam, onto the workpiece for the formation of a kerf on the workpiece. The device also includes an image acquisition unit to generate at least one image of a region of the workpiece, and an evaluation unit configured to determine, based on the at least one image, at least one measured variable for the course of the gap width of the kerf in a thickness direction of the workpiece. The invention also relates to an associated method for monitoring, in particular for closed-loop control, of a thermal cutting process carried out on a workpiece.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.