Self-rising board molding
US11472132B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2019 |
| Grant date | Oct 18, 2022 |
| Priority date | — |
| Expiry date | Oct 30, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/751
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Expandable substrates, which are referred to as blanks, are created by compressing thermobonded nonwovens after heating the binder material above its melting temperature, and then cooling the compressed nonwovens so that the binder material hardens and holds the fibers of the nonwoven together in a compressed configuration with stored kinetic energy. A mold for the component to be manufactured can be partially filled with a number of boards (or blanks) in a stacked, vertically, adjacent or even random orientation. Upon application of heat to the boards or blanks or parts in the mold, the binder material is melted so as to allow the nonwoven material to expand in one or more directions, and thereby fill all or part of the mold. Upon cooling, the binder material again hardens, and the molded component is retrieved from the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.