Fluid ejection devices including electrical interconnect elements for fluid ejection dies
US11472180B2 · kind B2 · utility
0Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2019 |
| Grant date | Oct 18, 2022 |
| Priority date | — |
| Expiry date | Feb 6, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/20
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A device includes a plurality of fluid ejection dies, wherein each of the fluid ejection dies includes a contact pad and a plurality of fluid actuation devices. The device includes an electrical interconnect element in contact with the contact pad of each of the fluid ejection dies to electrically interconnect the plurality of fluid ejection dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.