Patent · US Active

Method for producing damper structures on a micromechanical wafer

US11472698B2 · kind B2 · utility

0Cited by

0References

3Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Michael Stumber · Ditzingen, DE
Stefan Apelt · Gerlingen, DE

Key dates

Filing date	Apr 5, 2021
Grant date	Oct 18, 2022
Priority date	—
Expiry date	May 18, 2041

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/01
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for producing damper structures on a micromechanical wafer. The method includes: providing an at least partially UV-transparent master mold for molding damper structures; inserting and pressing a micromechanical wafer into the master mold so that micromechanical structures in the wafer are aligned in relation to the damper structures; filling the master mold with UV-curing LSR and subsequent UV irradiation; and mold release and removal of the connected structure of the micromechanical wafer with attached dampers. A method for producing a singulated MEMS chip comprising a UV-cured damper is also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.