Kit-less pick and place handler system for thermal testing
US11474147B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2018 |
| Grant date | Oct 18, 2022 |
| Priority date | — |
| Expiry date | Dec 19, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/0065
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure provides for a kit-less pick and place handler which conducts thermal testing of at least one device. An exemplary handler includes a thermal soak plate, a first prime mover, a second prime mover, a test site actuator, and a test contactor. The thermal soak plate can receive devices and maintain an accurate position of the devices using a friction between the thermal soak plate and the device. The test contactor can electrically contact the device. The first prime mover can place the device on the thermal soak plate. The second prime mover can carry the device to the test contactor, hold the device during thermal testing, and move the device from the test contactor. The test site actuator can exert force on the second prime mover during thermal testing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.