Multilayer electronic component
US11476047B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2021 |
| Grant date | Oct 18, 2022 |
| Priority date | — |
| Expiry date | May 20, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/232
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes a body in which internal electrodes including Ni and Sn and dielectric layers are alternately disposed, and external electrodes disposed on a surface of the body, connected to the internal electrodes, and including Cu and Sn, wherein the internal electrodes include an alloy including Ni, Cu, and Sn in a region in contact with the external electrodes, and Sn in an amount that satisfies the following formula: 1<C2/C1<13.5 in which C1 is the content of Sn of the internal electrodes at a central portion of the body and C2 is the content of Sn of the internal electrodes at a point 2 μm away from a point at which the internal electrode and the external electrode are in contact with each other in an inward direction of the body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.