Multi-layer ceramic electronic component, method of producing a multi-layer ceramic electronic component, and circuit board
US11476053B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 18, 2021 |
| Grant date | Oct 18, 2022 |
| Priority date | — |
| Expiry date | Feb 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10015
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multi-layer ceramic electronic component includes: a ceramic body including a first end surface and a second end surface facing in a direction of a first axis, and internal electrodes laminated in a direction of a second axis orthogonal to the first axis and drawn from the first end surface or the second end surface; a first external electrode disposed to cover the first end surface; and a second external electrode disposed to cover the second end surface. Each of the first external electrode and the second external electrode has an electrode end surface facing in the direction of the first axis. The electrode end surface includes a pair of first peripheral regions located at peripheral edges in the direction of the second axis, and a first concave region located between the pair of first peripheral regions and recessed from the pair of first peripheral regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.