Semiconductor device
US11476180B2 · kind B2 · utility
0Cited by
9References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 9, 2020 |
| Grant date | Oct 18, 2022 |
| Priority date | — |
| Expiry date | Jan 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48137
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device according to the present application includes: a current carrying unit having a semiconductor element; a case enclosing the current carrying unit; a heat dissipating plate located on a back side of the current carrying unit and the case; a plurality of thread fastening holes located in at least one of the case and the heat dissipating plate for fastening to an external heat dissipating system; and a plurality of tightening order display structures located near the respective thread fastening holes to display an order in which screws are tightened into the thread fastening holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.