Patent · US Active

Assembly of flexible and integrated module packages with leadframes

US11476182B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

Shenzhen Chipuller Chip Technology Co., LTD · CN

Inventors

Zhiquan Luo · Chandler, US
Jawad Nasrullah · Stanford, US
Omar Alnaggar · Palo Alto, US

Key dates

Filing date	Oct 8, 2018
Grant date	Oct 18, 2022
Priority date	—
Expiry date	Oct 8, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.