Selective micro device transfer to receiver substrate
US11476216B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2021 |
| Grant date | Oct 18, 2022 |
| Priority date | — |
| Expiry date | Jul 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0411
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.