Patent · US Active

Method of manufacturing an augmented LED array assembly

US11476217B2 · kind B2 · utility

0Cited by

20References

16Claims

0Family size

Assignee

LUMILEDS LLC · US

Inventors

Michael Deckers · Jülich, DE
Tze Yang Hin · Cupertino, US
Ronald Johannes Bonne · Plainfield, US

Key dates

Filing date	Mar 10, 2020
Grant date	Oct 18, 2022
Priority date	—
Expiry date	Mar 10, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/1053
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of manufacturing an augmented LED array assembly is described which comprises providing an LED array assembly configured for inclusion in an LED lighting circuit, the LED array assembly comprising a micro-LED array mounted onto a driver integrated circuit, the driver integrated circuit comprising contact pads configured for electrical connections to a circuit board assembly; providing an essentially planar carrier comprising a plurality of contact bridges, each contact bridge extending between a first contact pad and a second contact pad; and mounting the contact bridge carrier to the LED array assembly by forming solder bonds between the first contact pads of the contact bridge carrier and the contact pads of the driver integrated circuit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.