Light emitting structure
US11476239B2 · kind B2 · utility
1Cited by
49References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2020 |
| Grant date | Oct 18, 2022 |
| Priority date | — |
| Expiry date | Jan 8, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.