Patent · US Active

PCB structure and method and apparatus for forming the PCB structure

US11477878B2 · kind B2 · utility

0Cited by

4References

8Claims

0Family size

Assignee

Telefonaktiebolaget LM Ericsson (Publ) · SE

Inventors

Peng Liu · Beijing, CN
Tomas Bergsten · Gothenburg, SE

Key dates

Filing date	Sep 14, 2018
Grant date	Oct 18, 2022
Priority date	—
Expiry date	Sep 14, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/04
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A PCB structure and a method and apparatus for forming the PCB structure are disclosed. The PCB structure further includes a metal plate configured between a first PCB and a second PCB by soldering. Therefore, the PCB structure is easy to be produced and the feasibility can be improved with a cheap solution.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.