Cover film for flexible printed circuit board and flexible printed circuit board
US11477884B2 · kind B2 · utility
0Cited by
20References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2019 |
| Grant date | Oct 18, 2022 |
| Priority date | — |
| Expiry date | Apr 3, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/287
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to one aspect of the present disclosure, a cover film for a flexible printed circuit board includes: an adhesive layer; and a protective layer that is layered on a surface of the adhesive layer, wherein a lamination temperature range in which a ratio of a viscosity of the protective layer to a viscosity of the adhesive layer is five times or more is present within a temperature range of 50° C. or more and 150° C. or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.