Electronic component
US11477891B2 · kind B2 · utility
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1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2020 |
| Grant date | Oct 18, 2022 |
| Priority date | — |
| Expiry date | Feb 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10522
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic component includes a substrate including electrode pads disposed on an upper surface; and a plurality of multilayer capacitors mounted on the substrate and including external electrodes connected to the electrode pads. At least one multilayer capacitor among the plurality of multilayer capacitors is a multilayer capacitor of a horizontally stacked structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.