Method for formation of patterned solder mask
US11477894B2 · kind B2 · utility
0Cited by
6References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 6, 2020 |
| Grant date | Oct 18, 2022 |
| Priority date | — |
| Expiry date | Oct 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1338
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for formation of a patterned solder mask (10) on a substrate is provided, in which method the mask is deposited by a process of chemical deposition in vapor phase. A method for manufacturing a printed circuit board and/or an electronic component comprising formation of said patterned solder mask is further provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.