Wafer level ultrasonic chip module having suspension structure and manufacturing method thereof
US11478822B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 13, 2019 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | May 1, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A wafer level ultrasonic chip module includes a substrate, a composite layer and a base material. The substrate has a through slot passing through an upper surface and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The composite layer has a groove passing through an upper surface and a lower surface of the protective layer, and communicating with the through slot. The ultrasonic body corresponds to the through slot. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.