Thermoforming apparatus having deformation sensor and method
US11478977B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 24, 2018 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | May 25, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB30B15/34
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A thermoforming apparatus is provided having a pair of coacting platens, a load bearing structural member, a force applicator, and a deformation sensor. The pair of coacting platens and respective dies are configured to mate on opposed surfaces of a heated sheet of thermoformable material to form articles. The load bearing structural member is configured to carry the coacting platens and the dies in complementary closed relationship about the sheet during an article forming operation. The force applicator is carried by the structural member and configured to impart a forming load between the pair of opposed dies and platens and across the structural member during a forming operation. The deformation sensor is configured to span a first location and a second location on the structural member to detect deformation indicative of separation between the dies resulting from deformation. A method is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.