Lamination process
US11479022B2 · kind B2 · utility
0Cited by
43References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2018 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Apr 4, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/20
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A lamination process is disclosed. The process is useful for silicone based lamination adhesive compositions, in particular those which cure at or around room temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.