Polyimide precursor solution and polyimide film produced using same
US11479643B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Jun 27, 2018 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Feb 14, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2379/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to the production of a polyimide precursor, whereby, by using an amide-based organic solvent having a positive-number partition coefficient (Log P) and a density of at most 1 g/cm3, an interaction between the organic solvent and polyamic acid, which is a polyimide precursor, may be mitigated, thereby enabling the decrease of the viscosity of a polyimide precursor solution, and thus enabling a polyimide precursor solution having high solid content and low viscosity to be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.