Conductive composition and wiring board using the same
US11479686B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2020 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Feb 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1131
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The conductive composition of the present embodiment contains metal nanoparticles having an average particle diameter of 30 nm to 600 nm, metal particles having an average particle diameter larger than that of the metal nanoparticles, a thermosetting resin having an oxirane ring in a molecule, a curing agent, and a cellulose resin. Then, the specific resistance of the conductor formed by applying and calcining the conductive composition on the substrate is preferably 5.0×10−6 Ω·cm or less, and the conductor does not peel from the substrate when a tape having an adhesive force of 3.9 N/10 mm to 39 N/10 mm is pressed against the conductor and peeled off.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.