SnBiSb series low-temperature lead-free solder and its preparation method

US11479835B2 · kind B2 · utility

Assignee

• BEIJING COMPO ADVANCED TECHNOLOGY CO., LTD. · CN

Inventors

• Shaoming ZHANG · Beijing, CN
• Huijun HE · Shanghai, CN
• Xixue Liu · Beijing, CN
• Yanbin Sun · Beijing, CN
• Zhigang Wang · Lexington, US
• Qiang Hu · Longbeilingcun, CN
• Ning An · Hefei, CN
• Fuwen Zhang · Beijing, CN
• Jie Zhu · San Jose, US
• Jiangsong Zhang · Shanghai, CN
• Lirong Wang · Beijing, CN
• Huankun Zhang · Beijing, CN
• Lei Xu · Ottawa, CA
• Zhihua Zhu · Greenville, US
• Pin Zhang · Yokohama, JP

Key dates

• Filing date: Nov 17, 2016
• Grant date: Oct 25, 2022
• Expiry date: Sep 25, 2037

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C22C12/00
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

A SnBiSb series low-temperature lead-free solder and a preparation method thereof, which belongs to the technical field of low-temperature soldering. The lead-free solder includes by weight the following composition: 32.8-56.5% of Bi, 0.7-2.2% of Sb, with the remainder being Sn, wherein the weight percentages of Bi and Sb satisfy a relationship of b=0.006a2−0.672a+19.61+c, wherein the symbol a represents the weight percentage of Bi, the symbol b represents the weight percentage of Sb, and the range of c is −1.85≤c≤1.85. The solder alloy has a peritectic or near peritectic structure with a low melting point, and has an excellent mechanical performance and reliability, and applicable to the field of low-temperature soldering.