Micro device mass transfer tool
US11480742B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2020 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Jan 27, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/40
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A micro device transfer tool and methods of operation are described. In an embodiment, the micro device transfer tool includes an articulating transfer head assembly capable of six degrees of motion. A miniatured camera assembly may be secured near the point of contact for the articulating transfer head assembly to aid in system alignment. In an embodiment, an encoder system is described for alignment of a micro pick up array and target substrate using complementary concentric grating patterns. In an embodiment a miniaturized position sensor design is described for sensing position of various system components during alignment or pick and place processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.