Host electronic device having a movable cooling component for removable electronic device
US11481009B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 22, 2021 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Apr 23, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Example implementations relate to a host electronic device and a method of establishing a thermal contact with a removable electronic device by a cooling component of the host electronic device. The host electronic device includes a housing, the cooling component, and a plurality of flexible arms. The cooling component is movably coupled to the housing. The plurality of flexible arms extend towards an internal cavity of the housing to hold the cooling component in a first position (retracted position). Further, the plurality of flexible arms are displaceable from the internal cavity by a movement of the removable electronic device into the host electronic device, to allow the cooling component to drop down to a second position (extended position) for establishing the thermal contact with a heat generating component of the removable electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.