Apparatuses and methods for warpage measurement
US11481887B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2018 |
| Grant date | Oct 25, 2022 |
| Priority date | — |
| Expiry date | Jul 9, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention is directed to a system for measuring surface flatness, deformation and/or coefficient of thermal expansion (CTE) of a specimen comprising an image capture and analysis processing calibration means for performing image capture and analysis processing calibration of said system, a measuring means for measuring surface flatness of a specimen in a specimen holder, a heating means for heating said sample holder with a predetermined profile, and a control means for providing the predetermined heating profile onto the surface of said specimen and controlling operations of said image capture and analysis processing calibration means, said measuring means, and said heating means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.